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Business
Paras Defence to Invest ₹6,200 Cr for Chip Packaging Plant in Madhya Pradesh
✍️ Business Standard
🗓 22 Jul 2026, 03:40 PM
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Defense technology firm Paras Defence has announced a ₹6,200 crore investment to establish a chip packaging facility in Madhya Pradesh, aiming to strengthen India’s semiconductor supply chain.
Paras Defence, a prominent player in the defense technology sector, has unveiled plans to invest ₹6,200 crore in a new chip packaging facility in Madhya Pradesh. The plant will focus on the critical packaging stage of semiconductor production, which involves enclosing microchips in protective casings and connecting them to external circuitry.
The investment is part of a broader strategy to reduce India’s reliance on imported semiconductor components. By adding domestic packaging capabilities, Paras Defence aims to support the country’s growing demand for advanced electronics in defense and civilian applications.
While specific operational timelines have not yet been disclosed, the company has indicated that the facility will create a number of skilled jobs and contribute to the development of a more resilient local semiconductor ecosystem.
The investment is part of a broader strategy to reduce India’s reliance on imported semiconductor components. By adding domestic packaging capabilities, Paras Defence aims to support the country’s growing demand for advanced electronics in defense and civilian applications.
While specific operational timelines have not yet been disclosed, the company has indicated that the facility will create a number of skilled jobs and contribute to the development of a more resilient local semiconductor ecosystem.